Semiconductor device and semiconductor device manufacturing method

ABSTRACT

The present disclosure provides a semiconductor device including: a first semiconductor layer including a first region and a second region adjacent to the first region; a first insulator layer provided above the first semiconductor layer; an intermediate semiconductor layer, having an n-type conduction, provided above the first region of the first semiconductor layer and above the first insulator layer; a second insulator layer provided above the intermediate semiconductor layer; a second semiconductor layer provided above the first region of the first semiconductor layer and above the second insulator layer; a sensor formed in the second region of the first semiconductor layer; a contact electrode connected to the intermediate semiconductor layer; and a circuit element formed in the second semiconductor layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 USC 119 from Japanese PatentApplication No. 2015-187014, filed on Sep. 24, 2015, the disclosure ofwhich is incorporated by reference herein.

BACKGROUND

Technical Field

The present disclosure relates to a semiconductor device and asemiconductor device manufacturing method.

Related Art

Semiconductor devices in which a semiconductor layer formed with asensor, and a semiconductor layer formed with a peripheral circuit, arestacked on the same semiconductor substrate with an insulator filminterposed therebetween, are known.

Japanese Patent Application Laid-Open (JP-A) No. 2014-135454, forexample, describes a semiconductor device including: a photodiode havingan n-type second semiconductor layer and a p-type semiconductor regionprovided above a main face of the second semiconductor layer; a firstsemiconductor layer provided above the second semiconductor layer andformed with a transistor; a p-type third semiconductor layer providedbetween the first semiconductor layer and the second semiconductor layerand applied with ground potential; a first insulator layer providedbetween the first semiconductor layer and the third semiconductor layer;and a second insulator layer provided between the second semiconductorlayer and the third semiconductor layer.

JP-A No. 2014-135454 describes how, by fixing the p-type thirdsemiconductor layer to a ground potential, high voltage applied to thesecond semiconductor layer does not reach the first semiconductor layer,even in a case in which a high voltage is applied to the secondsemiconductor layer, in order to deplete the second semiconductor layer.

In the semiconductor device described in JP-A No. 2014-135454, when thethird semiconductor layer is exposed to plasma in a manufacturingprocess using plasma, such as etching or CVD, static charges charged inthe vicinity of a boundary between the third semiconductor layer and thefirst insulator layer, and charged in the vicinity of a boundary betweenthe third semiconductor layer and the second insulator layer, retain.Inversion layers are thereby formed inside the third semiconductorlayer, at the first insulator layer side and at the second insulatorlayer side, respectively. In a case in which n-type inversion layers areformed in the third semiconductor layer configured by a p-typesemiconductor, the entire third semiconductor layer cannot be fixed to apotential, even in a case in which the third semiconductor layer isapplied with the desired potential, and the third semiconductor layerenters an electrically floating state. Thus, in the semiconductor devicedescribed in JP-A No. 2014-135454, there may be cases that the thirdsemiconductor layer cannot be fixed to a desired potential, due toinversion layers occurring inside the third semiconductor layeroriginating from positive charges charged at the periphery of the thirdsemiconductor layer. In a case in which capacitive coupling occursbetween the third semiconductor layer in the floating state and thesecond semiconductor layer applied with a high voltage, anon-illustrated unintentional potential, corresponding to the highvoltage applied to the second semiconductor layer, is applied to thethird semiconductor layer, and a transistor formed in the firstsemiconductor layer may erroneously operate due to this influence.

SUMMARY

The present disclosure provides a semiconductor device and asemiconductor device manufacturing method that may fix an intermediatesemiconductor layer to a desired potential, even in cases in which, insemiconductor devices including an intermediate semiconductor layersandwiched in insulator layers between a semiconductor layer formed witha circuit element and a semiconductor layer formed with a sensor,positive charges are charged at the periphery of the intermediatesemiconductor layer.

A first aspect of the present disclosure is a semiconductor device,including: a first semiconductor layer including a first region and asecond region adjacent to the first region; a first insulator layerprovided above the first semiconductor layer; an intermediatesemiconductor layer, having an n-type conduction, provided above thefirst region of the first semiconductor layer and above the firstinsulator layer; a second insulator layer provided above theintermediate semiconductor layer; a second semiconductor layer providedabove the first region of the first semiconductor layer and above thesecond insulator layer; a sensor formed in the second region of thefirst semiconductor layer; a contact electrode connected to theintermediate semiconductor layer; and a circuit element formed in thesecond semiconductor layer.

A second aspect of the present disclosure is a semiconductor device,including: a first semiconductor layer including a first region and asecond region adjacent to the first region; a first insulator layerprovided above the first semiconductor layer; an intermediatesemiconductor layer, having a p-type conduction, provided above thefirst region of the first semiconductor layer and above the firstinsulator layer; a second insulator layer provided above theintermediate semiconductor layer; a second semiconductor layer providedabove the first region of the first semiconductor layer and above thesecond insulator layer; a sensor formed in the second region of thefirst semiconductor layer; a contact electrode connected to theintermediate semiconductor layer; and a circuit element formed in thesecond semiconductor layer, wherein the intermediate semiconductor layerhas a thickness such that a first inversion layer formed at a firstinsulator layer side of the intermediate semiconductor layer due topositive charges retained at the vicinity of a boundary between theintermediate semiconductor layer and the first insulator layer, and asecond inversion layer formed at the second insulator layer side of theintermediate semiconductor layer due to positive charges retained at thevicinity of a boundary between the intermediate semiconductor layer andthe second insulator layer, are not contiguous to each other.

A third aspect of the present disclosure is a semiconductor device,including: a first semiconductor layer including a first region and asecond region adjacent to the first region; a first insulator layerprovided above the first semiconductor layer; an intermediatesemiconductor layer provided above the first region of the firstsemiconductor layer and above the first insulator layer; a secondinsulator layer provided above the intermediate semiconductor layer; asecond semiconductor layer provided above the first region of the firstsemiconductor layer and above the second insulator layer; a sensorformed in the second region of the first semiconductor layer; a firstcontact region, having a p-type conduction, formed above theintermediate semiconductor layer, and a second contact region, having ann-type conduction, electrically connected to the first contact region; acontact electrode connected to the first contact region and to thesecond contact region; and a circuit element formed in the secondsemiconductor layer.

A fourth aspect of the present disclosure is a semiconductor devicemanufacturing method, including: preparing a semiconductor substratethat includes a first semiconductor layer including a first region and asecond region adjacent to the first region, a first insulator layerprovided above the first semiconductor layer, an intermediatesemiconductor layer provided above the first region of the firstsemiconductor layer and above the first insulator layer, a secondinsulator layer provided above the intermediate semiconductor layer, anda second semiconductor layer provided above the first region of thefirst semiconductor layer and above the second insulator layer; forminga circuit element in the second semiconductor layer; forming a sensor inthe second region of the first semiconductor layer; forming a firstcontact region having a p-type conduction and a second contact regionhaving an n-type conduction in the intermediate semiconductor layer; andforming a contact electrode that is connected to the first contactregion and the second contact region.

The present disclosure provides a semiconductor device and amanufacturing method that may fix the intermediate semiconductor layerto a desired potential, even in cases in which, in semiconductor devicesincluding an intermediate semiconductor layer sandwiched in insulatorlayers between the semiconductor layer formed with the circuit elementand the semiconductor layer formed with the sensor, positive charges arecharged at the periphery of the intermediate semiconductor layer.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments will be described in detail based on the followingfigures, wherein:

FIG. 1 is a cross-sectional view illustrating configuration of asemiconductor device according to an exemplary embodiment of the presentdisclosure;

FIG. 2A is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 2B is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 2C is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 3A is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 3B is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 3C is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 4A is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 4B is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 4C is a cross-sectional view illustrating a manufacturing method ofa semiconductor device according to an exemplary embodiment of thepresent disclosure;

FIG. 5 is a cross-sectional view illustrating a state inside anintermediate semiconductor layer in a case in which the intermediatesemiconductor layer is configured by a p-type semiconductor;

FIG. 6 is a cross-sectional view illustrating configuration of asemiconductor device according to another exemplary embodiment of thepresent disclosure;

FIG. 7 is a cross-sectional view illustrating a state inside anintermediate semiconductor layer according to another exemplaryembodiment of the present disclosure;

FIG. 8 is a graph plotted with values of current flowing through anintermediate semiconductor layer when thickness of the intermediatesemiconductor layer and voltage applied to the intermediatesemiconductor layer is changed;

FIG. 9A is a plan view illustrating relevant portions of a semiconductordevice according to another exemplary embodiment of the presentdisclosure;

FIG. 9B is a cross-sectional view along line 9B-9B in FIG. 9A;

FIG. 9C is a cross-sectional view along line 9C-9C in FIG. 9A; and

FIG. 9D is a cross-sectional view along line 9D-9D in FIG. 9A.

DETAILED DESCRIPTION

Explanation follows regarding examples of exemplary embodiments of thepresent disclosure, with reference to the drawings. Note that in each ofthe drawings, the same or equivalent configuration elements and portionsare appended with the same reference numerals, and duplicate explanationthereof is omitted if appropriate.

First Exemplary Embodiment

FIG. 1 is a cross-sectional view illustrating a configuration of asemiconductor device 100 according to an exemplary embodiment of thepresent disclosure. The semiconductor device 100 is configured includinga photodiode 11 configuring an X-ray sensor and a transistor 51 servingas a circuit element configuring a peripheral circuit. The photodiode 11is formed by a Double-Silicon On Insulator (Double-SOI) substrate inwhich a first semiconductor layer 10 configured by an n-typesemiconductor, a first insulator layer 20, an intermediate semiconductorlayer 30 configured by an n-type semiconductor, a second insulator layer40, and a second semiconductor layer 50 configured by a p-typesemiconductor, are stacked in this sequence.

The photodiode 11 includes an anode 12 configured by a highconcentration p-type semiconductor and a cathode 13 configured by a highconcentration n-type semiconductor, that are disposed separately fromeach other on a front face of the first semiconductor layer 10configured by low concentration n-type silicone. The photodiode 11 alsoincludes an anode electrode 74 connected to the anode 12, a cathodeelectrode 75 connected to the cathode 13, and a back face electrode 14formed on a back face of the first semiconductor layer 10.

Circuit elements including the transistor 51 are disposed at positionsof the second semiconductor layer 50 that do not overlap with thephotodiode 11. Namely, the first semiconductor layer 10 includes a firstregion and a second region that is adjacent to the first region. Thephotodiode 11 is provided in the second region of the firstsemiconductor layer 10, and the circuit elements including thetransistor 51 are provided above the first region of the firstsemiconductor layer 10. The transistor 51 is configured including achannel region 53, a gate electrode 55, source/drain regions 52, andsource/drain electrodes 72. The gate electrode 55 is provided above thechannel region 53. The source/drain regions 52 are each configured by ahigh concentration n-type semiconductor and are provided at positions oneither side of the channel region 53. The source/drain electrodes 72 areconnected to the source/drain regions 52. The front face of the secondsemiconductor layer 50 is covered by a third insulator layer 60configured by an insulator such as SiO₂.

The intermediate semiconductor layer 30 configured by an n-typesemiconductor is provided between the first semiconductor layer 10,formed in the photodiode 11, and the second semiconductor layer 50,formed with the circuit elements such as the transistor 51. The firstinsulator layer 20, configured by an insulator such as SiO₂, is providedbetween the intermediate semiconductor layer 30 and the firstsemiconductor layer 10. The second insulator layer 40, configured by aninsulator such as SiO₂, is provided between the intermediatesemiconductor layer 30 and the second semiconductor layer 50. A contactregion 31, configured by a higher concentration n-type semiconductorthan the intermediate semiconductor layer 30, is provided within theintermediate semiconductor layer 30. A contact electrode 71 is connectedto the contact region 31.

Explanation follows regarding a manufacturing method of thesemiconductor device 100. FIG. 2A to FIG. 2C, FIG. 3A to FIG. 3C, andFIG. 4A to FIG. 4C are cross-sectional views illustrating amanufacturing method of the semiconductor device 100.

First, the Double-Silicon On Insulator (Double-SOI) substrate 1 isprepared by sequentially stacking the first semiconductor layer 10configured by an n-type semiconductor, the first insulator layer 20, theintermediate semiconductor layer 30 configured by an n-typesemiconductor, the second insulator layer 40, and the secondsemiconductor layer 50 configured by a p-type semiconductor (FIG. 2A).

Next, a field oxide film 90 is formed in the second semiconductor layer50 by a Local Oxidation of Silicon (LOCOS) method. The area of thesecond semiconductor layer 50 where the field oxide film 90 is notformed becomes an active region 50A where the circuit elements such asthe transistor are formed (FIG. 2B).

Next, a gate oxide film 54 and a polysilicon film are deposited abovethe active region 50A of the second semiconductor layer 50. The gateelectrode 55 is then formed by patterning the polysilicon film usingphotolithographic technology (FIG. 2C).

Next, side walls 56 are formed at side faces of the gate electrode 55.The source/drain regions 52, configured by high concentration n-typesemiconductors at positions on either side of the gate electrode 55, arethen formed by implanting a dopant including a group 15 element, such asphosphorus or arsenic, into the active region 50A of the secondsemiconductor layer 50 using an ion-implantation method. The transistor51 is formed in this manner (FIG. 3A).

Next, the second semiconductor layer 50 (field oxide film 90) and thesecond insulator layer 40 are etched through by dry etching to form anopening 81 down to the intermediate semiconductor layer 30. The secondsemiconductor layer 50 (field oxide film 90), the second insulator layer40, the intermediate semiconductor layer 30, and the first insulatorlayer 20 are also etched through by dry etching to form openings 82 and83 down to the first semiconductor layer 10 (FIG. 3B).

Next, a dopant including a group 15 element, such as phosphorus orarsenic, is implanted into the area of the first semiconductor layer 10exposed at the opening 83 using an ion-implantation method, therebyforming the cathode 13. The cathode 13 is configured by a highconcentration n-type semiconductor and is formed on the front face ofthe first semiconductor layer 10. A dopant including a group 13 element,such as boron, is implanted into the area of the first semiconductorlayer 10 exposed by the opening 82 using an ion-implantation method,thereby forming the cathode 12. The cathode 12 is configured by a highconcentration p-type semiconductor and is formed on the front face ofthe first semiconductor layer 10. Furthermore, a dopant including agroup 15 element, such as phosphorus or arsenic, is implanted into thearea of the intermediate semiconductor layer 30 exposed by the opening81 using an ion-implantation method, thereby forming the contact region31. The contact region 31 is configured by a high concentration n-typesemiconductor, and is formed in the intermediate semiconductor layer 30(FIG. 3C).

Next, the third insulator layer 60, configured by an insulator such asSiO₂, is formed using a chemical vapor disposition (CVD) method, so asto cover the second semiconductor layer 50 formed with the circuitelements including the transistor 51. The openings 81, 82, and 83 formedin the previous processes are filled in by the third insulator layer 60(FIG. 4A).

Next, the third insulator layer 60, the second semiconductor layer 50,and the second insulator layer 40 are etched through by dry etching toform an opening 84 down to the contact region 31 formed in theintermediate semiconductor layer 30. The third insulator layer 60, thesecond semiconductor layer 50, the second insulator layer 40, theintermediate semiconductor layer 30, and the first insulator layer 20are also etched through by dry etching to form openings 87 and 88respectively down to the anode 12 and the cathode 13 formed in the firstsemiconductor layer 10 (FIG. 4B).

Next, a metal such as aluminum is deposited on the front face of thethird insulator layer 60 using a sputtering method. The openings 84, 85,86, 87, and 88 are filled in by this metal. The metal is then patternedwith a desired pattern. Thus, the contact electrode 71 connected to thecontact region 31, the source/drain electrodes 72 connected to thesource/drain regions 52, the anode electrode 74 connected to the anode12, and the cathode electrode 75 connected to the cathode 13, areformed. Next, the back face electrode 14 is formed on the back face ofthe first semiconductor layer 10 using a sputtering method (FIG. 4C).

FIG. 1 illustrates an example of a bias method when employing thesemiconductor device 100. In order to detect X-rays with thesemiconductor device 100, the first semiconductor layer 10 is depletedby applying a reverse bias voltage to the photodiode 11. Namely, inorder to detect X-rays with the semiconductor device 100, the back faceelectrode 14 and the cathode electrode 75 are connected to an anode of apower source 200, and the anode electrode 74 is connected to a groundpotential-connected cathode of the power source 200. The reverse biasvoltage applied to the photodiode 11 may, for example, be severalhundred volts.

The intermediate semiconductor layer 30, which is configured by ann-type semiconductor interposed between the first semiconductor layer 10and the second semiconductor layer 50, is fixed to the potential of thecathode of the power source 200 (ground potential), such that thecircuit elements including the transistor 51 formed on the secondsemiconductor layer 50 are not unintentionally operated (erroneouslyoperated) by the high voltage applied to the first semiconductor layer10. Namely, in order to detect X-rays with the semiconductor device 100,the contact electrode 71 connected to the intermediate semiconductorlayer 30 is connected to the ground potential-connected cathode of thepower source 200.

Hereinafter, a case in which an intermediate semiconductor layer 30 isconfigured by a p-type semiconductor, as described in JP-A No.2014-135454, is considered. FIG. 5 is a cross-sectional viewschematically illustrating a state that would occur inside theintermediate semiconductor layer 30 in a case in which the intermediatesemiconductor layer 30 is configured by a p-type semiconductor. Positivecharges arising when manufacturing the semiconductor device 100 retainin the vicinity of a boundary between the intermediate semiconductorlayer 30 and the first insulator layer 20 and the vicinity of a boundarybetween the intermediate semiconductor layer 30 and the second insulatorlayer 40. Thus, free electrons, these being minority carriers, are drawntoward the first insulator layer 20 side of the inside of theintermediate semiconductor layer 30, and an n-type inversion layer 32,where the conduction type of the intermediate semiconductor layer 30(p-type) has been inverted, is formed at the first insulator layer 20side of the inside of the intermediate semiconductor layer 30.Similarly, free electrons, these being minority carriers, are also drawntoward the second insulator layer 40 side of the inside of theintermediate semiconductor layer 30, and an n-type inversion layer 33 isformed at the second insulator layer 40 side of the inside of theintermediate semiconductor layer 30. In a case in which the inversionlayer 32 and the inversion layer 33 are contiguous to each other, thepotential of the intermediate semiconductor layer 30 enters a floatingstate not fixed to the ground potential, even in a case in which theground potential is applied to the intermediate semiconductor layer 30through the contact electrode 71. In a case in which capacitive couplingoccurs between the intermediate semiconductor layer 30 in the floatingstate and the first semiconductor layer 10 applied with a high voltageoccurs, a potential corresponding to the high voltage applied to thefirst semiconductor layer 10 is unintentionally imparted to theintermediate semiconductor layer 30. As a result, there is a concernthat the circuit elements, including the transistor 51 formed in thesecond semiconductor layer 50, erroneously operate.

However, in the semiconductor device 100 according to the presentexemplary embodiment of the present disclosure, the intermediatesemiconductor layer 30 is configured by an n-type semiconductor. Thus,inversion layers do not occur inside the intermediate semiconductorlayer 30, even in a case in which positive charges arising duringmanufacture of the semiconductor device 100 retain in the vicinity ofthe boundary between the intermediate semiconductor layer 30 and thefirst insulator layer 20, and the vicinity of the boundary between theintermediate semiconductor layer 30 and the second insulator layer 40.Thus, the potential of the intermediate semiconductor layer 30 may bereliably fixed to the ground potential by applying the ground potentialto the intermediate semiconductor layer 30 through the contact electrode71. This may enable high voltage applied to the first semiconductorlayer 10 to be suppressed from influencing the operation of the circuitelements including the transistor 51 formed in the second semiconductorlayer 50.

Note that, in the present exemplary embodiment, an example has beengiven of a case in which the intermediate semiconductor layer 30 alsoextends above a formation region of the photodiode 11 (namely, above thesecond region of the first semiconductor layer 10). However, as long asthe intermediate semiconductor layer 30 extends to at least below thecircuit elements including the transistor 51 formed to the secondsemiconductor layer 50 (above the first region of the firstsemiconductor layer 10), the advantageous effect of suppressing a highvoltage applied to the first semiconductor layer 10 from influencing thecircuit elements, may be obtained. Thus, the part of the intermediatesemiconductor layer 30 that extends above the formation region of thephotodiode 11 (above the second region of the first semiconductor layer10) may be omitted.

Second Exemplary Embodiment

FIG. 6 is a cross-sectional view illustrating configuration of asemiconductor device 101 according to a second exemplary embodiment ofthe present disclosure. FIG. 7 is a cross-sectional view illustrating astate inside an intermediate semiconductor layer 30A of thesemiconductor device 101.

In the semiconductor device 101, the intermediate semiconductor layer30A is configured by a p-type semiconductor. As illustrated in FIG. 7,the intermediate semiconductor layer 30A is formed with a thickness suchthat an inversion layer 32 and an inversion layer 33 are not contiguousto each other. The inversion layer 32 is formed at the first insulatorlayer 20 side of the intermediate semiconductor layer 30A due topositive charges retaining in the vicinity of the boundary between theintermediate semiconductor layer 30A and the first insulator layer 20.The inversion layer 33 is formed at the second insulator layer 40 sideof the intermediate semiconductor layer 30A due to positive chargesretaining in the vicinity of the boundary between the intermediatesemiconductor layer 30A and the second insulator layer 40. In thesemiconductor device 101 according to the second exemplary embodiment,configuration portions other than the intermediate semiconductor layer30A are similar to those in the semiconductor device 100 according tothe first exemplary embodiment.

FIG. 8 is a graph plotting values of current flowing through theintermediate semiconductor layer 30A when changing a thickness D of theintermediate semiconductor layer 30A and a voltage applied to theintermediate semiconductor layer 30A, in situations in which theinversion layer 32 and the inversion layer 33 are formed inside theintermediate semiconductor layer 30A as illustrated in FIG. 7.

As illustrated in FIG. 8, the thicker the thickness D of theintermediate semiconductor layer 30A, the larger the value of thecurrent flowing through the intermediate semiconductor layer 30A. Thisis because the thicker the thickness D of the intermediate semiconductorlayer 30A, the larger the spacing between the inversion layer 32 and theinversion layer 33, and the wider the width of the current path. Thus,by setting the thickness D of the intermediate semiconductor layer 30Aat a thickness such that the inversion layer 32 and the inversion layer33 are not contiguous to each other, the intermediate semiconductorlayer 30A configured by a p-type semiconductor may be fixed to a desiredpotential by applying the desired potential to the contact electrode 71.

As illustrated in FIG. 8, the current value is saturated by setting thethickness D of the intermediate semiconductor layer 30A at 150 nm orgreater. This indicates that the current constricting action of theinversion layer 32 and the inversion layer 33 is substantiallyeliminated by setting the thickness D of the intermediate semiconductorlayer 30A at 150 nm or greater. Namely, by setting the thickness D ofthe intermediate semiconductor layer 30A at 150 nm or greater, theinfluence of positive charges arising when manufacturing thesemiconductor device 101 is substantially eliminated, and theintermediate semiconductor layer 30A may be fixed to a desired potentialby applying the desired potential to the contact electrode 71.

Third Exemplary Embodiment

FIG. 9A is a plan view illustrating relevant portions of a semiconductordevice 102 according to a third exemplary embodiment of the presentdisclosure. FIG. 9B is a cross-sectional view along line 9B-9B in FIG.9A, FIG. 9C is a cross-sectional view along line 9C-9C in FIG. 9A, andFIG. 9D is a cross-sectional view along line 9D-9D in FIG. 9A.

In the semiconductor device 102, an intermediate semiconductor layer 30Bis a p-type semiconductor. A contact region 31P configured by a p-typesemiconductor and a contact region 31N configured by an n-typesemiconductor are provided to the intermediate semiconductor layer 30B.As illustrated in FIG. 9A and FIG. 9D, the contact region 31P and thecontact region 31N are disposed adjacent to each other. The surfaces ofthe contact regions 31P and 31N are covered by a common connectingelectrode 34. Namely, what is referred to as a butting contact structurein which the contact region 31P and the contact region 31N, which havedifferent conduction types to each other, are electrically connectedtogether through the connecting electrode 34, is formed in theintermediate semiconductor layer 30B. The contact electrode 71 isconnected to the connecting electrode 34. In the semiconductor device102 according to the third exemplary embodiment, configuration portionsother than the intermediate semiconductor layer 30B are similar to thosein the semiconductor device 100 according to the first exemplaryembodiment.

Explanation follows regarding an example of a manufacturing method ofthe semiconductor device 102. The circuit elements including thetransistor 51 are formed in the second semiconductor layer 50 of theDouble-SOI substrate by similar processes to the manufacturing method ofthe semiconductor device 100 according to the first exemplaryembodiment. The second semiconductor layer 50 (field oxide film 90) andthe second insulator layer 40 are then etched through to theintermediate semiconductor layer 30B, forming two openings (notillustrated in the drawings) for forming the contact regions 31N and31P. Next, the contact regions 31N and 31P are formed in sequence to theintermediate semiconductor layer 30B by sequentially implanting a dopantfor forming an n-type semiconductor and a dopant for forming a p-typesemiconductor into the intermediate semiconductor layer 30B through theabove-described openings using an ion-implantation method. Next, theconnecting electrode 34, configured by an alloy layer (silicide layer)that electrically connects the contact regions 31N and 31P, is formed onthe surfaces of the contact regions 31N and 31P using a salicideprocess. The anode 12 and the cathode 13 are then formed in the firstsemiconductor layer 10, after which the contact electrode 71, thesource/drain electrodes 72, the anode electrode 74, the cathodeelectrode 75, and the back face electrode 14 are formed, by similarprocesses to the manufacturing processes of the semiconductor device 100according to the first exemplary embodiment.

Note that, the contact region 31N configured by an n-type semiconductorand the cathode 13 may be formed at the same time by the sameion-implantation process, and the contact region 31P configured by ap-type semiconductor and the anode 12 may be formed at the same time bythe same ion-implantation process. In the present exemplary embodiment,an example has been given in which the connecting electrode 34 thatconnects the contact regions 31N and 31P together is configured by analloy layer (silicide layer) formed using a salicide process. However,the connecting electrode 34 may be a metal such as aluminum.

As illustrated in FIG. 9B, in the semiconductor device 102 according tothe present exemplary embodiment, in cases in which the inversion layer32 and the inversion layer 33 formed in the intermediate semiconductorlayer 30B are contiguous to each other and substantially the entireintermediate semiconductor layer 30B becomes n-type due to positivecharges retaining in the vicinity of a boundary between the intermediatesemiconductor layer 30B and the first insulator layer 20, and thevicinity of a boundary between the intermediate semiconductor layer 30Band the second insulator layer 40, the potential of the intermediatesemiconductor layer 30B may be fixed through the contact region 31Nconfigured by an n-type semiconductor by applying the desired potentialto the contact electrode 71. As illustrated in FIG. 9C, in cases inwhich the inversion layer 32 and the inversion layer 33 are notcontiguous to each other and in cases in which a p-type semiconductor isinterposed between the inversion layer 32 and the inversion layer 33,the potential of the intermediate semiconductor layer 30B may be fixedthrough the contact region 31P configured by a p-type semiconductor byapplying the desired potential to the contact electrode 71. In cases inwhich a charge amount of positive charges charged inside thesemiconductor device 102 is low, in cases in which the intermediatesemiconductor layer 30B has a thick thickness, and in cases in which theconcentration of impurities in the intermediate semiconductor layer 30Bis relatively high, for example, it is expected that the inversion layer32 and the inversion layer 33 will not be contiguous to each other. Incases in which inversion layers are not formed in the intermediatesemiconductor layer 30B, the potential of the intermediate semiconductorlayer 30B may be fixed through the contact region 31P configured by ap-type semiconductor.

In this manner, in the semiconductor device 102 according the presentexemplary embodiment, the contact region 31P configured by a p-typesemiconductor and the contact region 31N configured by an n-typesemiconductor are provided inside the intermediate semiconductor layer30B. This enables the intermediate semiconductor layer 30B to be fixedto a desired potential by applying the desired potential to the contactelectrode 71, regardless of the state of the inversion layer 32 and theinversion layer 33 formed inside the intermediate semiconductor layer30B. In the semiconductor device 102 according to the present exemplaryembodiment, the intermediate semiconductor layer 30B may be fixed to adesired potential regardless of the state of the inversion layers 32 and33, so that the thickness of the intermediate semiconductor layer 30Bdoes not need to be formed with a thickness such that the inversionlayers 32 and 33 are not contiguous to each other, unlike in thesemiconductor device 101 according to the second exemplary embodiment.

In the above explanation, an example has been given of a case in whichthe intermediate semiconductor layer 30B is configured by a p-typesemiconductor. However, the intermediate semiconductor layer 30B may beconfigured by an n-type semiconductor. Namely, in cases in which theintermediate semiconductor layer 30B is configured by an n-typesemiconductor, when inversion layers formed in the intermediatesemiconductor layer 30B are contiguous to each other and the entireintermediate semiconductor layer 30B becomes p-type due to negativecharge retaining in the vicinity of the boundary between theintermediate semiconductor layer 30B and the first insulator layer 20,and the vicinity of the boundary between the intermediate semiconductorlayer 30B and the second insulator layer 40, the potential of theintermediate semiconductor layer 30B may be fixed through the contactregion 31P configured by a p-type semiconductor by applying the desiredpotential to the contact electrode 71. In cases in which the inversionlayers are not contiguous to each other and there is an n-typesemiconductor interposed between upper and lower inversion layers, thepotential of the intermediate semiconductor layer 30B may be fixedthrough the contact region 31N configured by an n-type semiconductor byapplying the desired potential to the contact electrode 71. In cases inwhich the inversion layers are not formed in the intermediatesemiconductor layer 30B configured by an n-type semiconductor, thepotential of the semiconductor layer 30B may be fixed through thecontact region 31N configured by an n-type semiconductor. Thus, in thesemiconductor device 102 according to the present exemplary embodiment,the intermediate semiconductor layer 30B may be fixed to a desiredpotential regardless of the conduction type and the thickness of theintermediate semiconductor layer 30B.

What is claimed is:
 1. A semiconductor device comprising: a firstsemiconductor layer including a first region and a second regionadjacent to the first region; a first insulator layer provided above thefirst semiconductor layer; an intermediate semiconductor layer, havingan n-type conduction, provided above the first region of the firstsemiconductor layer and above the first insulator layer; a secondinsulator layer provided above the intermediate semiconductor layer; asecond semiconductor layer provided above the first region of the firstsemiconductor layer and above the second insulator layer; a sensorformed in the second region of the first semiconductor layer; a contactelectrode connected to the intermediate semiconductor layer; and acircuit element formed in the second semiconductor layer.
 2. Thesemiconductor device of claim 1, wherein: the sensor includes a p-typesemiconductor region and an n-type semiconductor region provided at aface at a first insulator layer side of the first semiconductor layer,and a back face electrode provided at a face at an opposite side fromthe face at the first insulator layer side of the first semiconductorlayer; and an anode of a power source is connected to the n-typesemiconductor region and to the back face electrode, and a cathode ofthe power source is connected to the p-type semiconductor region and tothe contact electrode.
 3. A semiconductor device comprising: a firstsemiconductor layer including a first region and a second regionadjacent to the first region; a first insulator layer provided above thefirst semiconductor layer; an intermediate semiconductor layer, having ap-type conduction, provided above the first region of the firstsemiconductor layer and above the first insulator layer; a secondinsulator layer provided above the intermediate semiconductor layer; asecond semiconductor layer provided above the first region of the firstsemiconductor layer and above the second insulator layer; a sensorformed in the second region of the first semiconductor layer; a contactelectrode connected to the intermediate semiconductor layer; and acircuit element formed in the second semiconductor layer, wherein theintermediate semiconductor layer has a thickness such that a firstinversion layer formed at a first insulator layer side of theintermediate semiconductor layer due to positive charges retained at thevicinity of a boundary between the intermediate semiconductor layer andthe first insulator layer, and a second inversion layer formed at thesecond insulator layer side of the intermediate semiconductor layer dueto positive charges retained at the vicinity of a boundary between theintermediate semiconductor layer and the second insulator layer, are notcontiguous to each other.
 4. The semiconductor device of claim 3,wherein the thickness of the intermediate semiconductor layer is 150 nmor greater.
 5. The semiconductor device of claim 3, wherein: the sensorincludes a p-type semiconductor region and an n-type semiconductorregion provided at a face at a first insulator layer side of the firstsemiconductor layer, and a back face electrode provided at a face at anopposite side from the face at the first insulator layer side of thefirst semiconductor layer; and an anode of a power source is connectedto the n-type semiconductor region and to the back face electrode, and acathode of the power source is connected to the p-type semiconductorregion and to the contact electrode.
 6. A semiconductor devicecomprising: a first semiconductor layer including a first region and asecond region adjacent to the first region; a first insulator layerprovided above the first semiconductor layer; an intermediatesemiconductor layer provided above the first region of the firstsemiconductor layer and above the first insulator layer; a secondinsulator layer provided above the intermediate semiconductor layer; asecond semiconductor layer provided above the first region of the firstsemiconductor layer and above the second insulator layer; a sensorformed in the second region of the first semiconductor layer; a firstcontact region, having a p-type conduction, formed above theintermediate semiconductor layer, and a second contact region, having ann-type conduction, electrically connected to the first contact region; acontact electrode connected to the first contact region and to thesecond contact region; and a circuit element formed in the secondsemiconductor layer.
 7. The semiconductor device of claim 6, furthercomprising a connecting electrode that covers the surfaces of the firstcontact region and the second contact region.
 8. The semiconductordevice of claim 7, wherein the connecting electrode is configuredincluding an alloy layer.
 9. The semiconductor device of claim 6,wherein: the sensor includes a p-type semiconductor region and an n-typesemiconductor region provided at a face at a first insulator layer sideof the first semiconductor layer, and a back face electrode provided ata face at an opposite side from the face at the first insulator layerside of the first semiconductor layer; and an anode of a power source isconnected to the n-type semiconductor region and to the back faceelectrode, and a cathode of the power source is connected to the p-typesemiconductor region and to the contact electrode.